Robert E Heath

Title: Innovations of Robert E Heath

Introduction

Robert E Heath is a notable inventor based in Endwell, NY (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of cooling arrangements for integrated circuit chips. His innovative approach has led to advancements that enhance the performance and reliability of electronic devices.

Latest Patents

One of Robert E Heath's key patents is titled "Restorable backbond for LSI chips using liquid metal coated dendrites." This patent describes an improved arrangement for cooling semiconductor integrated circuit chips that generate heat from microcircuits. The invention utilizes an interfacial layer of liquid metal alloy coated metallic dendrites, which is sandwiched between the chip and a heat sink. This design allows for enhanced cooling compared to previous methods. The patent also includes biasing means that urge the dendritic projections into engagement with the liquid metal alloy layer, creating a unitary heat transfer path from the chip to the module container.

Career Highlights

Robert E Heath is associated with the International Business Machines Corporation (IBM), where he has contributed to various projects and innovations in semiconductor technology. His work has been instrumental in developing solutions that address the challenges of heat management in electronic devices.

Collaborations

Throughout his career, Robert E Heath has collaborated with notable colleagues, including Robert Babuka and George J Saxenmeyer, Jr. These collaborations have fostered an environment of innovation and have led to the development of cutting-edge technologies in the field.

Conclusion

Robert E Heath's contributions to semiconductor technology, particularly through his patent on cooling arrangements for integrated circuit chips, highlight his role as an influential inventor. His work continues to impact the electronics industry, paving the way for more efficient and reliable devices.