This inventor holds 1 USPTO granted patent. Top assignee: The State University of New York. Active years: 2014.
Company Filing History:
Years Active: 2014
Title: The Innovations of Robert E Geer
Introduction
Robert E Geer is a notable inventor based in Niskayuna, NY (US). He has made significant contributions to the field of technology, particularly in the area of reconfigurable 3D interconnects. His work has implications for both digital and RF signals, showcasing his innovative approach to modern engineering challenges.
Latest Patents
Robert E Geer holds a patent for a "Reconfigurable RF/digital hybrid 3D interconnect." This invention provides a reconfigurable 3D interconnect that can be utilized for digital and RF signals. The design includes an array of vertical interconnect vias (or TSVs) that create a signal path between core elements of a 3D integrated circuit (IC). The routing circuit incorporated in this invention allows for real-time adjustments and capacity optimization of the TSVs, enhancing the efficiency of signal transmission between the elements.
Career Highlights
Geer is affiliated with the State University of New York, where he continues to contribute to research and development in his field. His innovative work has garnered attention and respect within the engineering community.
Collaborations
Some of his notable coworkers include Wei Wang and Tong Jing, who have collaborated with him on various projects, further enriching the research environment at the university.
Conclusion
Robert E Geer exemplifies the spirit of innovation through his work on reconfigurable 3D interconnects. His contributions are paving the way for advancements in technology that will benefit various applications in the future.