Brooklyn, NY, United States of America

Robert Dabrowski


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Innovations of Robert Dabrowski in Adhesive Bond Control

Introduction

Robert Dabrowski is an accomplished inventor based in Brooklyn, NY. He has made significant contributions to the field of adhesive technology, particularly through his innovative methods for modifying gel adhesion strength. His work has implications for various applications, including materials that respond to electric fields.

Latest Patents

Dabrowski holds a patent for "Methods and apparatus for modifying gel adhesion strength." This invention focuses on a method for controlling the adhesive bond between an electric-field responsive material and a substrate. The method utilizes an electric field to manage the strength and integrity of the adhesive bond. It can be employed for removing or delaminating materials that respond to electric fields from their substrates. Furthermore, the invention allows for the elimination of the electric field application and the reapplication of the previously removed material, thus restoring the adhesive bond's strength and integrity. The patent also includes apparatus designed for use in the bond controlling process.

Career Highlights

Robert Dabrowski is affiliated with New York University, where he continues to advance his research and innovations. His work has garnered attention for its practical applications in various industries, particularly in the realm of materials science.

Collaborations

Dabrowski has collaborated with notable colleagues, including Victor Barinov and Kalle M Levon. These partnerships have contributed to the development and refinement of his innovative approaches to adhesive technology.

Conclusion

Robert Dabrowski's contributions to adhesive bond control through his patented methods demonstrate his expertise and innovative spirit. His work not only enhances our understanding of adhesive technologies but also paves the way for future advancements in the field.

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