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For the Inventor, By the Inventor

Binghamton, NY, United States of America

Robert D Topa

USPTO Granted Patents = 10

Average Co-Inventor Count = 3.9

ph-index = 5

Forward Citations = 116(Granted Patents)


Company Filing History:

goldMedal10 out of 164,197 
 
International Business Machines Corporation
 patents

Years Active: 1986-2003

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10 patents (USPTO):Explore Patents
1. 6626196 - Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing (2003-09-30),
2. 6228246 - Removal of metal skin from a copper-Invar-copper laminate (2001-05-08),
3. 6179990 - Biased acid cleaning of a copper-invar-copper laminate (2001-01-30),
4. 5242569 - Thermocompression bonding in integrated circuit packaging (1993-09-07),
5. 5237743 - Method of forming a conductive end portion on a flexible circuit member (1993-08-24),
6. 5148261 - Thermocompression bonding in integrated circuit packaging (1992-09-15),
7. 5135155 - Thermocompression bonding in integrated circuit packaging (1992-08-04),
8. 5120418 - Lead frame plating apparatus for thermocompression bonding (1992-06-09),
9. 5006917 - Thermocompression bonding in integrated circuit packaging (1991-04-09),
10. 4564426 - Process for the deposition of palladium-nickel alloy (1986-01-14),

Title: The Innovative Contributions of Robert D. Topa

Introduction

Robert D. Topa is a notable inventor based in Binghamton, NY (US), recognized for his significant contributions to the field of technology and engineering. With a total of 10 patents to his name, Topa has made remarkable advancements that enhance various industrial processes.

Latest Patents

One of Topa's latest patents is titled "Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing." This invention addresses the challenge of removing air or gas bubbles from drilled holes in printed circuit boards before the copper plating process. By utilizing ultrasonic prewetting in a liquid bath, this method ensures that all vias are degassed, allowing for reliable plating.

Another significant patent is "Removal of metal skin from a copper-Invar-copper laminate." This method innovatively combines electrochemical polishing with ultrasonics to remove metal skin from through-hole surfaces without causing differential etchback. The process involves dissolving the metal skin in an acid solution while using ultrasonics to sweep it out, ensuring a clean and efficient etching process.

Career Highlights

Robert D. Topa is currently employed at International Business Machines Corporation (IBM), where he continues to develop innovative solutions in technology. His work has had a profound impact on the industry, particularly in improving manufacturing processes and product reliability.

Collaborations

Throughout his career, Topa has collaborated with talented individuals such as Sung Kwon Kang and Michael J. Palmer. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Robert D. Topa's contributions to the field of technology through his patents and collaborations highlight his role as a leading inventor. His innovative methods not only advance industrial processes but also set a standard for future developments in the industry.

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