This inventor holds 1 USPTO granted patent. Top assignee: Amazon Technologies, Inc.. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018
Title: The Innovative Contributions of Robert Cong Liang
Introduction
Robert Cong Liang is a notable inventor based in Dublin, CA (US). He has made significant contributions to the field of electronic device housings. His innovative approach to design and functionality has led to the development of a unique patent that enhances the performance and aesthetics of electronic devices.
Latest Patents
Robert Cong Liang holds a patent for a "Multi-layer injection molded device housing." This invention features a housing for an electronic device that includes a single rear housing assembly coupled to the cover glass of a display assembly. The rear housing assembly consists of a metal rear chassis with two layers of injection molded material formed on at least the chassis side regions. The first injection molded layer contains a high reinforcing agent content percentage to provide increased stiffness. In contrast, the second injection molded layer has a low reinforcing agent content percentage, which offers less structural support than the first layer but improves aesthetic appearance.
Career Highlights
Robert Cong Liang is currently employed at Amazon Technologies, Inc. His work at this leading technology company allows him to explore innovative solutions and contribute to the advancement of electronic device design. His patent reflects his commitment to enhancing product functionality and user experience.
Collaborations
Robert has collaborated with talented coworkers, including Michael Xingyi Yu and Angel Wilfredo Martinez. These collaborations have fostered a creative environment that encourages the exchange of ideas and innovative thinking.
Conclusion
Robert Cong Liang's contributions to the field of electronic device housings exemplify the spirit of innovation. His patent for a multi-layer injection molded device housing showcases his ability to blend functionality with aesthetic appeal. His work continues to influence the design of electronic devices, making him a significant figure in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile