US

Robert C Hayden

This inventor holds 0 USPTO granted patents, plus 1 CIPO patent.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Robert C Hayden. Retrieved from https://idiyas.com/inventor/robert-c-hayden

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

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Title: Innovations by Robert C Hayden

Introduction

Robert C Hayden is an inventive mind based in the United States. He has made significant contributions to the field of engineering, particularly in the design of specialized tools. His innovative approach has led to the development of a unique bandsaw blade that enhances cutting efficiency.

Latest Patents

Robert C Hayden holds a patent for the "Triple Chip Ground Carbide Tip Bandsaw Blade With Ductile Filler." This invention features a continuous loop of hardened tempered bandsaw steel, equipped with carbide-tipped teeth arranged in pairs. Each pair consists of a "high" tooth and a "low" tooth, designed to provide triple-chip cutting action. The teeth are ground to create radial and tangential relief angles on the side surfaces, which helps to reduce blade vibration during cutting. The teeth are secured to the blade body through brazing with a solder that includes a discrete layer of ductile metal, which absorbs forces induced in the brazing zone under dynamic load conditions.

Career Highlights

Robert C Hayden is associated with Milford Products Corporation, where he applies his expertise in tool design and engineering. His work has been instrumental in advancing the capabilities of bandsaw blades, making them more efficient and effective for various cutting applications.

Conclusion

Robert C Hayden's innovative contributions to the design of bandsaw blades demonstrate his commitment to enhancing tool performance. His patent reflects a deep understanding of material properties and cutting mechanics, showcasing his role as a significant inventor in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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