Robert C Greenlese

Title: The Innovations of Robert C. Greenlese

Introduction

Robert C. Greenlese is a notable inventor based in Lagrangeville, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work primarily focuses on the development of planar integrated circuit interconnects, which are crucial for modern electronic devices.

Latest Patents

Among his latest patents, Greenlese has developed a process for making a planar integrated circuit interconnect. This semiconductor device features a substrate with a first line wire formed within it, a dielectric layer on top, and a second line wire embedded in the dielectric layer. Additionally, it includes a contact via that extends through the dielectric layer, connecting the two line wires, and a dummy via filled with low dielectric material. This innovative design enhances the performance and efficiency of integrated circuits.

Career Highlights

Greenlese is currently employed at International Business Machines Corporation (IBM), where he continues to push the boundaries of semiconductor technology. His expertise and innovative mindset have led to advancements that benefit the industry and contribute to the evolution of electronic devices.

Collaborations

Throughout his career, Greenlese has collaborated with talented individuals such as Bachir Dirahoui and Daniel C. Edelstein. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Robert C. Greenlese's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the industry positively, paving the way for future innovations.