Robert B Currie

Title: The Innovative Contributions of Robert B. Currie

Introduction

Robert B. Currie is a notable inventor based in Berkley, MA (US). He has made significant contributions to the field of materials science, particularly in the area of electroless plating. His work focuses on enhancing the adhesion of metal to thermoplastic substrates, which is crucial for various industrial applications.

Latest Patents

Currie's most recent patent is titled "Conditioning process for electroless plating of polyetherimides." This innovative process promotes the adhesion of metal to thermoplastic substrates such as polyetherimides. The improvement involves conditioning the substrate by treating it with an inorganic hydroxide solution prior to the steps of etching and deposition of a metal coating. This method increases adhesion between the substrate and the metal without compromising the flexural strength of the substrate throughout subsequent processing steps. He holds 1 patent in this area.

Career Highlights

Currie is associated with Shipley Company LLC, where he applies his expertise in materials science to develop advanced solutions for electroless plating. His work has been instrumental in improving manufacturing processes and enhancing product performance in various applications.

Collaborations

Throughout his career, Currie has collaborated with talented individuals such as James E. Rychwalski and Paul J. Ciccolo. These collaborations have contributed to the advancement of technologies in the field of electroless plating and materials science.

Conclusion

Robert B. Currie's innovative work in the conditioning process for electroless plating has made a significant impact on the industry. His contributions continue to influence advancements in materials science and manufacturing processes.