Lake Forest, CA, United States of America

Robert A Rauch


Average Co-Inventor Count = 1.5

ph-index = 5

Forward Citations = 113(Granted Patents)


Location History:

  • El Toro, CA (US) (1993)
  • Poway, CA (US) (1991 - 2004)
  • Lake Forest, CA (US) (1999 - 2006)

Company Filing History:


Years Active: 1991-2006

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9 patents (USPTO):Explore Patents

Title: Innovations by Inventor Robert A. Rauch: A Look at His Contributions to Heat Transfer Technology

Introduction

Robert A. Rauch, hailing from Lake Forest, California, is an accomplished inventor known for his innovative contributions to heat transfer technology. With a remarkable portfolio of nine patents, Rauch has made significant advancements that enhance the performance of electronic components through effective thermal management.

Latest Patents

One of Rauch's latest patents is focused on a thermal interface wafer and a method of making and using the same. This invention is designed to facilitate efficient heat transfer from electronic components to heat sinks. The thermal interface wafer is composed of at least one elongate, vertically-oriented strip of thermally conductive material, topped with a layer of conformable, heat-conducting material. The substrate ideally comprises a metal foil, such as aluminum or other thermally-conductive metals, formed into a flat, spiral-like coil. The strip may also have a serpentine configuration or be created from multiple strips. This innovative approach not only allows for effective heat transfer but also outlines methods for fabricating the thermal interface wafers.

Career Highlights

Throughout his career, Robert A. Rauch has worked with prominent companies, including Loctite Corporation, where he has collaborated on various projects that push the boundaries of thermal management solutions. His inventions have consistently showcased a commitment to improving the efficacy and reliability of electronic devices.

Collaborations

Rauch has had the opportunity to work alongside notable colleagues such as Raymond G. Freuler and Gary E. Flynn. These collaborations have likely contributed to the success of his projects, creating a synergy that fosters creativity and innovation within the field.

Conclusion

Robert A. Rauch stands as a prominent figure in the realm of innovations focused on heat transfer technology. His latest inventions, particularly the thermal interface wafer, highlight his ability to solve complex challenges faced by electronic components. As technology continues to advance, the significance of innovators like Rauch becomes increasingly vital in ensuring efficient thermal management solutions.

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