Other

Loctite Corporation

Henkel Corporation

Power Devices, Inc.

Sovac Corporation

The Accessory Group Inc.

Robert A Rauch

Raymond G Freuler

Gary E Flynn

Milos Sovak

John William Hunter

Robert M Fryer

Philip J Sluder

Dawayne Jacobs

A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.

Thermal interface wafer and method of making and using the same

An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin and, optionally, paraffin and petrolatun having electrically-conductive particles suspended therein, which preferably include graphite diamond, or elemental metals such as silver. In the preferred embodiment, the composition further includes a resin polymer to increase durability. The composition is formulated to be solid in the range of normal room temperatures, but liquify once subjected to temperatures just below the range at which heat generating electronic semi conductor devices typically operate. The present invention further comprises processes for packaging the compositions of the present invention, as well as applying the heat conductive composition to an interface between a heat-dissipating component and a heat sink.

Phase change thermal interface composition having induced bonding property

An airfoil launching system having a rod with a structure attached to a first end of the rod. A pusher holds a ring airfoil and has a sufficient coefficient of friction that the ring airfoil will generally rotate with the pusher and is rotatably and slidably mounted on the rod. Propulsive force is provided by resilient bands connected to the structure outward from the rod and to the pusher outward from the central aperture of the pusher. A grip attached to the pusher is utilized to draw the pusher toward the second end of the rod, thereby stretching and energizing the resilient bands, and also to rotate the pusher and, consequently, the airfoil.

Ring airfoil launching system

An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin having particles of graphite suspended therein. In the preferred embodiment, the composition further includes a polymer to increase durability. The composition is formulated to be solid in the range of normal room temperatures, but liquify once subjected to temperatures just below the range at which heat generating electronic semi conductor devices typically operate. The present invention further comprises processes for transferring heat from a heat-dissipating component to a heat dissipater, which comprises applying the heat conductive composition to an interface between a heat-dissipating component and a heat sink. The compositions and methods of the present invention provide a highly efficient heat transfer which correspondingly produces system economic advantages and component liability enhancement.

Graphitic allotrope interface composition and method of fabricating the same

Glasses

Headwear that produces sound from a signal is provided by an audio device in addition to the normal features of the headwear. The audio headwear of the present invention may be configured as a visor, goggles or a headband. In a preferred embodiment, the present invention is an audio visor comprising a flexible body, a protective layer and two speaker elements. The speaker elements are attached between the flexible body and the protective layer attached to cover the bottom side of the flexible body. Thus, the speaker elements do not interfere with the operation of flexible body as a visor. The preferred embodiment also comprises conductor leads and an amplifier to adapt the output of the audio device for the speaker elements. In the second embodiment, the audio headwear further comprises a lens attached to the flexible body to form goggles or sunglasses.

Multipurpose headwear

A cutter link for a chain saw chain containing a conical raker spaced forward of a round cutter face. The raker protects most of the cutter face from sudden impact and, together with the cutting and rake angles of the cutter face, provides for a filing rather than a chiseling action by the cutter link. Saw chains incorporating the novel cutter link are impact and wear resistant.

Growing community of inventors

Lake Forest, CA, United States of America

Robert A Rauch