Plainfield, NJ, United States of America

Robert A Barker

This inventor holds 1 USPTO granted patent. Top assignee: Bell Telephone Laboratories. Active years: 1983.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Robert A Barker. Retrieved from https://idiyas.com/inventor/robert-a-barker-dbgfkryl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 1983

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1 patent (USPTO):Explore Patents

Title: Robert A. Barker and Integrated Circuit Interconnections.

Introduction

Robert A. Barker is an inventor associated with Plainfield, New Jersey, and Bell Telephone Laboratories. His documented patent concerns a process for forming electrical connections within an integrated circuit.

Latest Patents

Barker’s listed patent is “Integrated Circuit Device Connection Process.” It describes forming an insulating layer over a silicon chip and opening a window in that layer above a conductive layer. A metallic plug is placed in the window using a lift-off technique, after which an interconnection pattern is formed to contact the plug and connect the conductive layers. Barker is credited with 1 patent in the information provided.

Career Highlights

Barker’s patent reflects work on integrated-circuit fabrication, particularly methods for creating reliable electrical interconnections between conductive layers. The supplied information identifies Bell Telephone Laboratories as his company.

Collaborations

Edith C. Ong is identified as Barker’s coworker. The available information does not specify whether she collaborated on the patent.

Conclusion

Robert A. Barker’s documented invention addresses a practical challenge in integrated-circuit manufacturing by using a metallic plug to connect conductive layers through an insulating layer.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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