Location History:
- Il Via Bandada, CA (US) (2004)
- Rancho Santa Margarita, CA (US) (2004)
Company Filing History:
Years Active: 2004
Title: The Innovations of Robbie U Villanueva
Introduction
Robbie U Villanueva is an accomplished inventor based in Il Via Bandada, California. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative spirit and technical expertise.
Latest Patents
One of his latest patents is the "Leadless chip carrier for reduced thermal resistance." This invention involves a semiconductor die situated in a cutout section of a substrate, which is placed on a printed circuit board. The design ensures that the semiconductor die is effectively supported, enhancing thermal management. Another notable patent is the "Flip-chip leadframe package." This invention features a leadframe with a paddle and peripheral leads, designed to prevent solder from flowing out during the solder reflow process, thereby reducing the risk of shorting adjacent solder bump pads.
Career Highlights
Robbie U Villanueva works at Skyworks Solutions, Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing solutions that improve the performance and reliability of electronic devices.
Collaborations
He collaborates with talented individuals such as Mahyar S Dadkhah and Hassan S Hashemi, contributing to a dynamic team environment that fosters innovation and creativity.
Conclusion
Robbie U Villanueva's contributions to semiconductor technology through his patents reflect his dedication to innovation. His work at Skyworks Solutions, Inc. continues to influence the industry positively.