The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2004
Filed:
Dec. 07, 2001
Michael J. Jarcy, Tustin, CA (US);
Andrew R. Gizara, Lake Forest, CA (US);
Evans S. McCarthy, Costa Mesa, CA (US);
Robbie U. Villanueva, Il Via Bandada, CA (US);
Hassan S. Hashemi, Laguna Niguel, CA (US);
Mahyar S. Dadkhah, Harvard, MA (US);
Skyworks Solutions, Inc., Irvine, CA (US);
Abstract
According to one embodiment, a semiconductor die is situated in a cutout section of a substrate. In one embodiment, the substrate is situated on a printed circuit board such that the semiconductor die situated in the cutout section of the substrate is also situated on a support pad on the top surface of the printed circuit board. In one embodiment, a semiconductor die bond pad on the semiconductor die is connected to a substrate bond pad on the substrate. In one embodiment, an interconnect trace on the substrate is connected to an interconnect pad on the top surface of the printed circuit board.