Beijing, China

Risheng Li

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Hangzhou Dareruohan Technology Co., Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Risheng Li. Retrieved from https://idiyas.com/inventor/risheng-li

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Risheng Li: Innovator in Heat Dissipation Technology

Introduction

Risheng Li is a prominent inventor based in Beijing, China. He has made significant contributions to the field of heat dissipation technology, particularly in the context of chip and server systems. His innovative approach addresses critical challenges in managing heat in electronic devices.

Latest Patents

Risheng Li holds a patent for a heat dissipation plate designed for chip heat dissipation, a server heat dissipation system, and a heating device. The patent outlines a heat dissipation plate with one end blocked and the other end equipped with a water inlet and outlet. The design includes a pipeline assembly featuring multiple branch water inlet and outlet pipelines, enhancing the efficiency of heat management in electronic systems.

Career Highlights

Risheng Li is associated with Hangzhou Dareruohan Technology Co., Ltd., where he applies his expertise in developing advanced heat dissipation solutions. His work has been instrumental in improving the performance and reliability of electronic devices.

Collaborations

Risheng Li collaborates with talented professionals in his field, including Yunfeng Liu and Liedong Wang. Their combined efforts contribute to the advancement of innovative technologies in heat management.

Conclusion

Risheng Li's contributions to heat dissipation technology exemplify the importance of innovation in enhancing electronic device performance. His patent and collaborative efforts reflect a commitment to addressing the challenges of heat management in modern technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…