This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Toray Industries, Inc.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Risano Nakajima: Innovator in Semiconductor Technology
Introduction
Risano Nakajima is an inventor based in Otsu-shi, Japan. He has made significant contributions to the field of semiconductor technology, focusing on innovative methods for manufacturing semiconductor devices. Although he currently holds no granted patents, his work is paving the way for advancements in this critical area.
Latest Patent Applications
Risano Nakajima's latest patent applications include two notable innovations. The first application, titled "LAMINATE, RESIN COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE," describes a laminate that enables the transfer of semiconductor elements over a wide range of processing margins using lasers of various wavelengths. This technology ensures that the elements are not damaged and that no pasty residue is left behind. The laminate consists of a laser-transmitting substrate, a resin film, and a semiconductor element, arranged in that order. The absorbance of the resin film at wavelengths of 248 nm, 266 nm, or 355 nm, expressed in terms of a film thickness of 1.0 μm, ranges from 0.4 to 5.0. Additionally, the adhesive strength of the resin film with respect to the semiconductor elements is between 0.02 and 0.3 N/cm.
The second application, "LAMINATE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE," presents a laminate that can be implemented with a wide processing margin without adhesive residue or damage to the semiconductor element during transfer using laser light of various wavelengths. This laminate is created by laminating a substrate with laser permeability, a resin film 1, and a resin film 2 in that order. The light absorbance of resin film 1, calculated for a film thickness of 1.0 μm at any wavelength from 200 nm to 1100 nm, is also between 0.4 and 5.0. The adhesive strength of the surface of resin film 2, on the side opposite that of resin film 1, is similarly between 0.02 and 0.3 N/cm.
Conclusion
Risano Nakajima is an innovative inventor whose work in semiconductor technology is noteworthy. His latest patent applications demonstrate his commitment to advancing the field and improving manufacturing processes. As he continues to develop his ideas, he may soon contribute significantly to the industry.