Sakai, Japan

Rinzo Kamikura

This inventor holds 1 USPTO granted patent. Top assignee: Kanzaki Paper Manufacturing Co., Ltd.. Active years: 1991.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rinzo Kamikura. Retrieved from https://idiyas.com/inventor/rinzo-kamikura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 68(Granted Patents)


Company Filing History:


Years Active: 1991

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1 patent (USPTO):Explore Patents

Title: Rinzo Kamikura: Innovator in Adhesive Technology

Introduction

Rinzo Kamikura is a notable inventor based in Sakai, Japan. He has made significant contributions to the field of adhesive technology, particularly with his innovative adhesive sheet design. His work has garnered attention for its unique composition and practical applications.

Latest Patents

Kamikura holds a patent for an adhesive sheet that comprises a release sheet base material, an undercoat layer, a release agent layer, an adhesive layer, and a surface sheet. This adhesive sheet is characterized by an undercoat layer made from a water-dispersible acrylate or methacrylate copolymer resin. The resin has an emulsifier content of about 2 to 10 wt. % based on the total amount of the monomers used for preparing the copolymer. Additionally, the resin has a glass transition temperature ranging from about -60°C to about 20°C. The overall bulk density of the release sheet base material with the undercoat layer is up to 1.0 g/cm³.

Career Highlights

Rinzo Kamikura is associated with Kanzaki Paper Manufacturing Co., Ltd., where he has been instrumental in developing innovative adhesive solutions. His expertise in adhesive technology has positioned him as a key figure in the industry.

Collaborations

Kamikura has collaborated with notable colleagues, including Shuichiro Takeda and Hideaki Suzuki. Their combined efforts have contributed to advancements in adhesive technology and product development.

Conclusion

Rinzo Kamikura's contributions to adhesive technology through his innovative patent demonstrate his commitment to advancing the field. His work continues to influence the industry and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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