This inventor holds 1 USPTO granted patent and 6 published patent applications. Top assignees: Kagoshima University, Molex Japan Co., Ltd.. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 80 
1 out of 14 Years Active: 2015
Title: Rinkou Fukunaga: Innovator in Circuit Element Technology
Introduction
Rinkou Fukunaga is a notable inventor based in Kagoshima, Japan. He has made significant contributions to the field of circuit element technology, particularly with his innovative patent related to heat sink packages.
Latest Patents
Fukunaga holds a patent for a heat sink package and method of manufacturing. This invention involves arranging a circuit element on an organic substrate and connecting it to a wiring pattern. An internal connection electrode is formed on a conductive support body through electroforming, creating a unitary block. After sealing the circuit element with resin, the support body is peeled off, allowing for individual internal connection electrodes to be used as external connection electrodes.
Career Highlights
Throughout his career, Rinkou Fukunaga has worked with prominent organizations such as Molex Japan Co., Ltd. and Kagoshima University. His experience in these institutions has contributed to his expertise in circuit technology and innovation.
Collaborations
Fukunaga has collaborated with notable coworkers, including Kenji Ohsawa and Katsuya Tsuruta. Their joint efforts have likely enhanced the development and application of his inventions.
Conclusion
Rinkou Fukunaga's contributions to circuit element technology through his innovative patent demonstrate his commitment to advancing the field. His work continues to influence the industry and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile