Limburgerhof, Germany

Rik Noordijk


Average Co-Inventor Count = 7.0

ph-index = 3

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2001-2003

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3 patents (USPTO):Explore Patents

Title: Celebrating the Innovations of Rik Noordijk

Introduction

Rik Noordijk, an accomplished inventor based in Limburgerhof, Germany, has made significant contributions to the field of materials science through his innovative patented technologies. With a total of three patents to his name, Noordijk's work primarily revolves around pioneering advancements in pressure-sensitive adhesives.

Latest Patents

Noordijk's latest patents showcase his expertise in developing innovative adhesive solutions. His patents include:

1. **Pressure sensitive adhesives based on polymers of multistage construction**

2. **Pressure sensitive materials based on a multistep constituted of polymerizates**

These inventions reflect his commitment to enhancing the performance and application of pressure-sensitive adhesives.

Career Highlights

Rik Noordijk is currently associated with BASF Aktiengesellschaft, a leading global chemical company known for its commitment to innovation and sustainability. His role there has allowed him to push the boundaries of adhesive technology, contributing to the company's reputation as a pioneer in chemical research and development.

Collaborations

Throughout his career, Noordijk has worked alongside talented individuals such as Bernhard Schuler and Gerhard Auchter. Their collaboration has fostered a creative environment that encourages the exchange of ideas, leading to innovative solutions in adhesive technology.

Conclusion

Rik Noordijk's patents and collaborative efforts demonstrate his significant impact in the field of adhesives. His work not only reflects his ingenuity but also sets the stage for future innovations that can enhance various industrial applications. As he continues his journey at BASF, the contributions of Noordijk are likely to influence the industry for years to come.

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