San Juan Capistrano, CA, United States of America

Ricky Donald Heckler

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Metawave Corporation. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ricky Donald Heckler. Retrieved from https://idiyas.com/inventor/ricky-donald-heckler

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Ricky Donald Heckler: Innovator in Integrated Circuit Assembly

Introduction

Ricky Donald Heckler is a notable inventor based in San Juan Capistrano, California. He has made significant contributions to the field of integrated circuit packaging, showcasing his innovative spirit through his patented inventions.

Latest Patents

Heckler holds a patent for an "Assembly in place method and apparatus." This invention utilizes a guide or carrier to assemble and position multiple Integrated Circuit packages (AiPs) on a substrate while maintaining appropriate spacing. The design of the carrier is thin and flexible, allowing for some movement while ensuring that tolerances are maintained at specific locations. This innovation not only reduces package size but also enhances the overall efficiency of the assembly process.

Career Highlights

Ricky Donald Heckler is currently employed at Metawave Corporation, where he continues to push the boundaries of technology in integrated circuit assembly. His work has been instrumental in advancing the methods used in the industry, making him a valuable asset to his team.

Collaborations

Heckler collaborates with talented individuals such as Soren Shams and Raul Inocencio Alidio, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Ricky Donald Heckler's contributions to the field of integrated circuit packaging exemplify his dedication to innovation. His patented methods and collaborative spirit continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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