Rick Sullivan

Title: Rick Sullivan: Innovator in Packaging Technology

Introduction

Rick Sullivan is a notable inventor based in Salem, MA (US). He has made significant contributions to the field of packaging technology, particularly through his innovative patent that enhances the functionality and efficiency of packaged integrated devices.

Latest Patents

Rick Sullivan holds a patent for "Packages and methods for packaging using a lid having multiple conductive layers." This patent describes a packaged integrated device that includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, creating a defined package interior. Notably, the package lid features an interior coating that ensures good adhesion with the epoxy, while the exterior coating is designed for RF shielding. The materials used for the interior and exterior coatings differ, with nickel used for the interior lid coating and tin for the exterior lid coating. This innovative approach enhances the performance and reliability of packaged devices.

Career Highlights

Rick Sullivan is currently employed at Analog Devices, Inc., where he continues to develop cutting-edge technologies in the packaging sector. His work has been instrumental in advancing the capabilities of integrated devices, making them more efficient and reliable.

Collaborations

Rick has collaborated with talented individuals such as Jicheng Yang and Asif Chowdhury, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Rick Sullivan's contributions to packaging technology through his patent and work at Analog Devices, Inc. highlight his role as an influential inventor in the field. His innovative solutions continue to shape the future of integrated device packaging.