The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Nov. 17, 2011
Jicheng Yang, North Andover, MA (US);
Asif Chowdhury, Middleton, MA (US);
Manolo Mena, Manila, PH;
Jia Gao, Winchester, MA (US);
Rick Sullivan, Salem, MA (US);
Thomas Goida, Windham, NH (US);
Carlo Tiongson, Cavite, PH;
Dipak Sengupta, Boxborough, MA (US);
Jicheng Yang, North Andover, MA (US);
Asif Chowdhury, Middleton, MA (US);
Manolo Mena, Manila, PH;
Jia Gao, Winchester, MA (US);
Rick Sullivan, Salem, MA (US);
Thomas Goida, Windham, NH (US);
Carlo Tiongson, Cavite, PH;
Dipak Sengupta, Boxborough, MA (US);
Analog Devices, Inc., Norwood, MA (US);
Abstract
Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.