Company Filing History:
Years Active: 2014-2015
Title: The Innovative Contributions of Carlo Tiongson
Introduction
Carlo Tiongson is a notable inventor based in Cavite, Philippines. He has made significant contributions to the field of integrated devices, holding 2 patents that showcase his innovative approach to packaging technologies.
Latest Patents
Tiongson's latest patents include advancements in packaging methods for integrated devices. One of his patents focuses on packages and methods for packaging, which details a packaged integrated device that consists of a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is affixed to the package substrate using epoxy, creating a defined package interior. Notably, the package lid features an interior coating that promotes good adhesion with the epoxy, while the exterior coating is designed for RF shielding. In this embodiment, the interior lid coating is made of nickel, and the exterior lid coating is composed of tin.
Another patent by Tiongson elaborates on packaging methods that utilize a lid with multiple conductive layers. Similar to his previous patent, this invention includes a package substrate, a package lid, and an integrated circuit or MEMS device. The innovative design ensures effective adhesion and RF shielding, further enhancing the functionality of packaged integrated devices.
Career Highlights
Carlo Tiongson is currently employed at Analog Devices, Inc., where he continues to develop cutting-edge technologies in the field of integrated devices. His work has contributed to the advancement of packaging methods that are crucial for the performance and reliability of electronic devices.
Collaborations
Throughout his career, Tiongson has collaborated with talented professionals such as Jicheng Yang and Asif Chowdhury. These collaborations have fostered an environment of innovation and creativity, leading to the development of impactful technologies.
Conclusion
Carlo Tiongson's contributions to the field of integrated devices through his patents and work at Analog Devices, Inc. highlight his role as a significant inventor. His innovative packaging methods are paving the way for advancements in electronic device performance and reliability.