Vancouver, WA, United States of America

Rick C Jerome

This inventor holds 1 USPTO granted patent. Top assignee: Utmc Microelectronic Systems Inc.. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rick C Jerome. Retrieved from https://idiyas.com/inventor/rick-c-jerome-z1kok3oh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Rick C Jerome: Innovator in Integrated Circuit Metallization Techniques

Introduction

Rick C Jerome is a notable inventor based in Vancouver, WA (US). He has made significant contributions to the field of integrated circuits, particularly in the area of metallization techniques. His innovative approach has led to the development of a unique method that enhances the performance and reliability of integrated circuits.

Latest Patents

Rick C Jerome holds a patent for a Multi-level interconnect metallization technique. This patent discloses a method of forming metallization layers and vias as part of an interconnect structure within an integrated circuit (IC). The metallization layers and vias are formed of an alloy consisting of tungsten and one or more other materials such as aluminum, gold, copper, cobalt, titanium, molybdenum, or platinum. Alternatively, the alloy may include aluminum and exclude tungsten. The alloy that forms the metallization layers and vias is deposited onto the IC substrate using ionized cluster beam (ICB) apparatus. The IC substrate is an 'in-process' IC, meaning various active devices, such as bipolar and/or MOS transistors, resistors, and capacitors, are formed in the substrate using conventional techniques prior to the ICB deposition of the alloy layers. Intermediate IC substrate processing steps, such as patterning and etching to form the vias, may take place in-between ICB deposition steps. He has 1 patent to his name.

Career Highlights

Rick C Jerome has had a distinguished career in the field of microelectronics. He is currently associated with Utmc Microelectronic Systems Inc., where he continues to innovate and develop advanced technologies for integrated circuits. His work has been instrumental in pushing the boundaries of what is possible in microelectronic design and fabrication.

Collaborations

Rick has collaborated with various professionals in the field, including his coworker James C Weaver. These collaborations have fostered an environment of innovation and have contributed to the advancement of technologies in integrated circuits.

Conclusion

Rick C Jerome is a pioneering inventor whose work in metallization techniques for integrated circuits has made a lasting impact on the industry. His innovative methods and dedication to advancing technology continue to inspire future developments in microelectronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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