Richard William Brown

Title: Innovations by Richard William Brown

Introduction

Richard William Brown is an accomplished inventor based in Grove City, Ohio. He holds 2 patents that showcase his expertise in electrical interconnections for circuit boards. His innovative designs have contributed significantly to the field of electronics.

Latest Patents

One of his latest patents is for a "Bottom entry interconnection element for connecting components to a circuit board." This invention features a planar portion designed for surface mounting on a circuit board, allowing for efficient coupling of components. The design includes opposing spring fingers that capture component leads, ensuring a reliable connection.

Another notable patent is for "Interconnection pin/socket components for electrically connecting two circuit boards and method for mounting said components in a circuit board." This invention provides a mechanical and electrical interconnection between two circuit boards using a pin and socket mechanism. The design allows for automated assembly and ensures a strong soldered connection, enhancing the reliability of electronic devices.

Career Highlights

Throughout his career, Richard has worked with prominent companies such as CommScope, Inc. and Andrew Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Richard has collaborated with talented individuals in the field, including Sanjay Sudhaker Upasani and Sebsibe Kebede. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Richard William Brown's contributions to the field of electronics through his patents and collaborations highlight his innovative spirit and dedication to advancing technology. His work continues to influence the design and functionality of circuit board interconnections.