Los Lunas, NM, United States of America

Richard T Knudson

This inventor holds 1 USPTO granted patent and 1 published patent application, plus 1 CIPO patent. Top assignee: Sandia Corporation. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard T Knudson. Retrieved from https://idiyas.com/inventor/richard-t-knudson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: The Innovations of Richard T. Knudson: Pioneering EMI Structures

Introduction: Richard T. Knudson is a distinguished inventor based in Los Lunas, New Mexico. With a unique focus on electromagnetic interference (EMI) structures, Knudson has successfully contributed to the field of electrical engineering through innovative designs. His expertise has culminated in the securing of a significant patent, showcasing his commitment to advancing technology and enhancing functional capabilities.

Latest Patents: Richard T. Knudson holds a patent for "Full tape thickness feature conductors for EMI structures." This innovation involves the formation of generally annular full tape thickness conductors created in single or multiple tape layers, which are stacked to produce an annular solid conductive wall. This wall acts as an enclosure for an electromagnetic isolation cavity. The novel conductors may be formed through punch and fill operations or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity. This invention stands as a testament to Knudson's ingenuity and technical understanding.

Career Highlights: Throughout his career, Richard T. Knudson has made significant strides while working at Sandia Corporation. His role at this esteemed organization has allowed him to explore various innovative concepts, ultimately leading to the successful development and patenting of key technologies in the EMI sector. Knudson's contributions reflect not only his technical skills but also his forward-thinking approach to solving complex challenges in the field of electrical engineering.

Collaborations: Richard has collaborated with fellow professionals such as Kenneth A. Peterson and Frank R. Smith, both of whom have played integral roles in various projects. Their teamwork has fostered a creative environment that enables them to bring their innovative ideas to life and enhance the depth of their research and inventions.

Conclusion: Richard T. Knudson's work exemplifies the spirit of innovation that drives advancements in technology. Through his patent on full tape thickness feature conductors for EMI structures, he continues to shape the landscape of electromagnetic applications. His collaborations and career at Sandia Corporation highlight the importance of teamwork and ingenuity in the pursuit of groundbreaking inventions. As technology evolves, Knudson's contributions will likely remain influential in driving progress within the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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