Wappingers Falls, NY, United States of America

Richard P Ferlita

This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard P Ferlita. Retrieved from https://idiyas.com/inventor/richard-p-ferlita

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 10.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2010

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2 patents (USPTO):Explore Patents

Title: The Innovative Journey of Richard P. Ferlita

Introduction

Richard P. Ferlita is a notable inventor based in Wappingers Falls, NY, who has made significant contributions to the field of solder alloys. With an impressive portfolio that includes two patents, his work primarily focuses on improving the properties and performance of lead-free solder compositions.

Latest Patents

Among his latest patents is the invention titled "Method and Process for Reducing Undercooling in a Lead-Free Tin-Rich Solder Alloy." This innovative process involves the addition of one or more nucleation modifiers in trace amounts to a lead-free tin-rich solder alloy. The goal is to develop a solder composition that exhibits reduced or suppressed undercooling temperature characteristics. The nucleation modifiers facilitate the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin-based lead-free solder without materially affecting the melting point of the solder composition. This advancement allows for efficient soldering processes, pinning substrates together using predetermined solder balls, while maintaining other solder joints in a liquid state.

Career Highlights

Richard works at the prestigious International Business Machines Corporation (IBM), where he applies his expertise in material science and engineering to innovate solutions that enhance electronic manufacturing. His contributions reflect his commitment to advancing the technology of solder materials.

Collaborations

Throughout his career, Richard has collaborated with esteemed colleagues, including Gareth Geoffrey Hougham and Kamalesh K. Srivastava. These collaborations have likely fostered an environment of shared knowledge and innovation, leading to groundbreaking developments in the field of solder technology.

Conclusion

Richard P. Ferlita's contributions to the field of solder alloys, especially through his patent on reducing undercooling in lead-free solder compositions, highlight his role as an influential inventor in the industry. His work at IBM, coupled with valuable collaborations, showcases his dedication to innovation and improving manufacturing processes, marking him as a noteworthy figure in the realm of materials science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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