Loveland, OH, United States of America

Richard M Jones


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Richard M Jones: Innovator in Ergonomic Packaging Solutions

Introduction

Richard M Jones is an accomplished inventor based in Loveland, OH (US). He has made significant contributions to the field of packaging design, focusing on ergonomics to enhance user experience and safety. His innovative approach has led to the development of a unique patent that addresses common issues faced when lifting cartons.

Latest Patents

Richard M Jones holds a patent for an ergonomic package configuration. This design features a carton with a first lateral side that includes a slot providing a hand hold near the bottom of the carton. Additionally, the second lateral side has a slot that offers a second hand hold near the top of the carton. The strategic placement of these hand holds encourages users to bend their knees while lifting, rather than straining their backs. This thoughtful design aims to reduce the risk of injury and improve the overall lifting experience.

Career Highlights

Richard M Jones is currently employed at Em Industries, Inc., where he continues to innovate and develop new packaging solutions. His work has been instrumental in advancing ergonomic designs that prioritize user safety and comfort. With a focus on practical applications, he has successfully translated his ideas into tangible products that benefit consumers.

Collaborations

Richard has collaborated with Andrew M Parrella, a fellow innovator at Em Industries, Inc. Together, they have worked on various projects aimed at improving packaging efficiency and user experience.

Conclusion

Richard M Jones exemplifies the spirit of innovation in the packaging industry. His commitment to ergonomic design not only enhances product usability but also promotes safety for consumers. Through his work, he continues to make a positive impact in the field of packaging solutions.

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