Company Filing History:
Years Active: 1989-1995
Title: The Innovative Contributions of Richard L. Simmons
Introduction
Richard L. Simmons is a notable inventor based in Jonestown, TX (US). He has made significant contributions to the field of microelectronics, particularly in the area of flip chip bonding technology. With a total of 6 patents to his name, Simmons has demonstrated a commitment to advancing the capabilities of electronic device manufacturing.
Latest Patents
Simmons' latest patents include a high force compression flip chip bonding system. This innovative method and system precisely and forcefully engage a flip chip device with a corresponding wiring pattern on a substrate. The design prevents shifting of the flip chip device and substrate during force application. The method involves determining the centroid of the pattern formed by the interconnects on the flip chip device. The flip chip device is then directed toward the substrate to contact the corresponding wiring pattern. The interconnects are compressed into the wiring pattern using a bonding force directed along a neutral axis of deflection coincident with the centroid. This approach minimizes lateral shifting, ensuring precise bonding of the interconnects to the wiring pattern.
Career Highlights
Simmons is currently employed at the Microelectronics and Computer Technology Corporation, where he continues to innovate and develop new technologies. His work has had a profound impact on the efficiency and reliability of electronic devices.
Collaborations
Throughout his career, Simmons has collaborated with talented individuals such as Michael J. Bertram and James D. Wehrly, Jr. These partnerships have fostered an environment of creativity and innovation, leading to advancements in their respective fields.
Conclusion
Richard L. Simmons is a distinguished inventor whose work in flip chip bonding technology has significantly influenced the microelectronics industry. His innovative patents and collaborations highlight his dedication to advancing technology and improving manufacturing processes.