Microelectronics and Computer Technology Corporation

Richard L Simmons

Michael J Bertram

James D Wehrly, Jr

Daniel M Andrews

Philip J Spletter

A high force flip chip bonding method and system that precisely and forcefully engage a flip chip device with a corresponding wiring pattern on a substrate in a manner that prevents flip chip device and substrate shifting during force application. The method includes the steps of determining the centroid of the pattern formed by the interconnects on the flip chip device. The flip chip device is directed toward the substrate for contacting the corresponding wiring pattern with the interconnects and then the interconnects are compressed into the corresponding wiring pattern using a bonding force. The bonding force is directed along a neutral axis of deflection that is coincident with the centroid. Applying the bonding force along the neutral axis of deflection at the centroid minimizes lateral shifting of the flip chip device relative to the substrate to precisely bond the interconnects to the corresponding wiring pattern.

High force compression flip chip bonding system

High force compression flip chip bonding method and system

The excise and lead form of TAB leads bonded to an integrated circuit chip. Leads extending beyond a sidewall are clamped between a first clamp and a form anvil at a first portion spaced from the chip. The leads are also clamped between an excise/form tool and a second clamp at a second portion spaced further from the chip than the first portion. An excise blade cuts the leads outside the second portion. Then the excise/form tool, second clamp and excise blade move downwards in a curved path toward the chip to form a first lead corner against the form anvil and a second lead corner against the excise/form tool without splaying or galling the leads.

Method and apparatus for forming metal leads

Method and apparatus for the excise and lead form of TAB devices

An apparatus and method for cutting strip or reel form of TAB tape into individual sites ready for further processing. In addition, a lead plating buss may be removed at the same time. A universal and adjustable apparatus includes preferably two cutter assemblies positioned adjacent a replaceable tape adapter and a clamp foot is actuated prior to cutting, for holding the tape, and is also magnetically attracted toward the movable cutter blade.

Tab tape singulation apparatus and method

A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.

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Jonestown, TX, United States of America

Richard L Simmons