Company Filing History:
Years Active: 2001-2004
Title: Innovations of Richard L. Canull
Introduction
Richard L. Canull is an accomplished inventor based in Pleasant Valley, NY (US). He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His work focuses on innovative processes that enhance the functionality and reliability of electronic devices.
Latest Patents
Richard's latest patents include a "Process for forming a multi-level thin-film electronic packaging structure" and a "Multi-level thin-film electronic packaging structure and related method." Both patents describe a structure for mounting electronic devices that utilizes a non-conductive, compliant spacer positioned between an underlying carrier and an overlying thin film. This spacer features a pattern of through-vias that align with opposing interconnects on both surfaces of the carrier and the thin film. This design allows solder connections to extend through the vias, ensuring electrical connectivity while smoothing out topography. The process involves building the thin film on a first sacrificial carrier and further processing it on a second sacrificial carrier to prevent distortion during manufacturing. The solder connections are formed using a closed solder joining process, and the spacer is employed with laminate cards to create thermal stress release structures.
Career Highlights
Richard L. Canull is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing the technology used in electronic devices, making them more efficient and reliable.
Collaborations
Richard has collaborated with notable coworkers, including Chandrika Prasad and Roy Rongqing Yu, contributing to a dynamic and innovative work environment.
Conclusion
Richard L. Canull's contributions to electronic packaging through his patents and work at IBM highlight his role as a significant inventor in the field. His innovative approaches continue to shape the future of electronic device manufacturing.