Richard L Anderson, Jr

Title: Richard L. Anderson, Jr.: Inventor of a Solderless Laser Assembly

Introduction

Richard L. Anderson, Jr., of Eldersburg, Maryland, is an inventor associated with Ciena Corporation. His patent work addresses a practical challenge in laser-diode circuit design: connecting and disconnecting a laser diode from a printed circuit board without soldering or damaging the components. Anderson is credited with 1 patent.

Latest Patents

Anderson’s patent, “Solderless Laser Assembly,” describes an assembly for connecting a laser diode to a printed circuit board (PCB) and removing it when needed. The design secures a heatsink to the PCB with cap screws and spacers, while a retainer block and additional screws hold the laser diode against the heatsink.

The diode is positioned through a cutout in the PCB. Fuzz button carriers sit between the diode and the board, guiding the diode leads into contact with conductive fuzz buttons. These buttons electrically connect the leads to pads on the PCB.

The arrangement provides a convenient way to remove or replace the laser diode and related components. It can support repairs, modifications, or upgrades while reducing the risk of damaging the diode or PCB.

Career Highlights

Anderson’s documented patent highlights an engineering contribution focused on serviceability and component replacement in laser assemblies. By combining mechanical retention with electrical contacts that do not require soldering, the design offers a practical alternative for connecting a laser diode to a circuit board.

Collaborations

Anderson is associated with Ciena Corporation. Edward Joseph Jablonski and David B. Harris are identified as coworkers.

Conclusion

Richard L. Anderson, Jr.’s “Solderless Laser Assembly” presents a replaceable, solderless approach to connecting laser diodes to printed circuit boards, emphasizing convenient maintenance and reduced risk of component damage.