Richard J Ketz

Title: Richard J Ketz: Innovator in 3D Printing Technology

Introduction

Richard J Ketz is a notable inventor based in Norristown, PA (US). He has made significant contributions to the field of 3D printing, particularly in enhancing interlayer adhesion in printed materials. His innovative approach has led to the development of a unique filament that improves the quality and durability of 3D printed articles.

Latest Patents

Richard J Ketz holds 1 patent for his invention titled "3D printing with enhanced interlayer adhesion." This patent describes a filament for three-dimensional printing that comprises a thermoplastic resin and an acrylic polymer additive. The additive is present in an amount ranging from 0.1 to 20 parts per hundred of the thermoplastic resin (phr). The patent also discloses a 3D printed article prepared from the filament and a process for preparing filament for three-dimensional printing.

Career Highlights

Ketz is associated with Rohm and Haas Company, where he has been instrumental in advancing 3D printing technologies. His work focuses on improving the performance of 3D printed materials, making them more reliable and effective for various applications.

Collaborations

One of his notable coworkers is Manoj Nerkar, with whom he has likely collaborated on various projects within the realm of 3D printing and material science.

Conclusion

Richard J Ketz's contributions to 3D printing technology exemplify the innovative spirit of modern inventors. His work continues to influence the industry, paving the way for advancements in material science and manufacturing processes.