This inventor holds 2 USPTO granted patents. Top assignee: Curtiss-Wright Corporation. Active years: 1976.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1976
Title: Richard J Haberski: Innovator in Heat Exchanger Technology
Introduction
Richard J Haberski is a notable inventor based in Emerson, NJ (US). He has made significant contributions to the field of heat exchanger technology, holding a total of 2 patents. His work focuses on innovative designs that enhance the efficiency of heat transfer systems.
Latest Patents
Haberski's latest patents include a multi-pass heat exchanger featuring finned conduits of polygonal shape. This innovative design comprises an open-ended shell that receives a first fluid, with a tube bank connected to pass a second fluid in indirect heat transfer. The conduits are uniquely configured in a flattened helical shape, allowing for effective heat exchange between the fluids. Another significant patent is the built-up tube and tubesheet assembly for multi-conduit heat exchangers. This assembly includes conduits with four-sided polygonal end portions, secured together to form a robust frame. The method of fabrication involves dip soldering or brazing, ensuring a secure and sealed connection.
Career Highlights
Richard J Haberski is currently employed at Curtiss-Wright Corporation, where he continues to innovate in the field of heat exchangers. His expertise and dedication to improving heat transfer technologies have made him a valuable asset to the company.
Collaborations
One of his notable coworkers is William R Litke, with whom he has likely collaborated on various projects within the company.
Conclusion
Richard J Haberski's contributions to heat exchanger technology through his patents and work at Curtiss-Wright Corporation highlight his role as an influential inventor in the industry. His innovative designs continue to push the boundaries of efficiency in heat transfer systems.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
