Stow, MA, United States of America

Richard J Casabona


Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 243(Granted Patents)


Company Filing History:


Years Active: 1980-1992

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5 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Richard J. Casabona

Introduction

Richard J. Casabona is a notable inventor based in Stow, MA (US). He has made significant contributions to the field of technology, particularly in the areas of electronic packaging and computer networking. With a total of 5 patents, his work has had a lasting impact on the industry.

Latest Patents

One of Casabona's latest patents is a package designed for EMI, ESD, thermal, and mechanical shock protection of integrated circuit chips. This innovative package not only provides mechanical shock and thermal protection but also shields the chips from electromagnetic interference and electrostatic discharge. The design includes a printed wiring board base for the reception of circuit chips, along with a conductive heat sink and cover. The heat sink, in conjunction with a reference plane in the wiring board base, acts as an EMI shield. Additionally, the package features compliant pads that support the chips, ensuring they are securely held in position and thermally connected to the heat sink.

Another significant patent is the dual path bus structure for computer interconnection. This bus structure is designed for computer networks that require high availability and reliability of communications. It incorporates multiple bus paths, allowing for quick detection of path failures and automatic switching to an alternate path without host involvement. This innovative approach enhances the efficiency and reliability of data transmission in computer networks.

Career Highlights

Richard J. Casabona has had a distinguished career at Digital Equipment Corporation, where he has been instrumental in developing cutting-edge technologies. His work has not only advanced the capabilities of electronic devices but has also contributed to the overall progress of the tech industry.

Collaborations

Throughout his career, Casabona has collaborated with several talented individuals, including John V. Levy and David P. Rodgers. These collaborations have fostered innovation and have led to the successful development of various technologies.

Conclusion

Richard J. Casabona's contributions to the fields of electronic packaging and computer networking exemplify his innovative spirit and dedication to advancing technology. His patents continue to influence the industry, showcasing the importance of creativity and collaboration in driving progress.

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