Taunton, MA, United States of America

Richard H Sargent


Average Co-Inventor Count = 1.3

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 1995-1997

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2 patents (USPTO):Explore Patents

Title: Richard H. Sargent: Innovator in Diebonding Technology

Introduction

Richard H. Sargent is a notable inventor based in Taunton, MA (US). He has made significant contributions to the field of diebonding technology, holding 2 patents that showcase his innovative approach to device placement and bonding methods.

Latest Patents

One of his latest patents is the "Gas pressure adjustable diebonding apparatus and method." This invention features a diebonding head that includes a chamber with openings in its end walls. It utilizes a rod-and-piston combination that extends through the chamber, allowing for adjustable force exerted on devices being diebonded. The design incorporates a gas inlet port and gas pressure resisting means, which work together to control the movement of the piston. This innovative approach enhances the precision of diebonding processes.

Another significant patent by Sargent is focused on "Diebonding geometry for packaging optoelectronics." This patent describes a solder geometry for epi-down diebonding an optoelectronic component to a heat sink platform. The solder deposition pattern includes exposure windows that create gaps or diebond bridges, allowing for precise registration of the active regions of the components.

Career Highlights

Richard H. Sargent has been associated with GTE Laboratories Incorporated, where he has applied his expertise in developing advanced diebonding technologies. His work has contributed to the enhancement of manufacturing processes in the electronics industry.

Collaborations

Sargent has collaborated with Robert A. Boudreau, working together to advance the field of diebonding technology. Their partnership has led to innovative solutions that improve device placement and bonding techniques.

Conclusion

Richard H. Sargent's contributions to diebonding technology reflect his commitment to innovation and excellence. His patents demonstrate a deep understanding of the complexities involved in device placement and bonding, making him a significant figure in the field.

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