Gte Laboratories Incorporated

Richard H Sargent

Robert A Boudreau

A device placement or diebonding head for a diebonding apparatus including a chamber with openings in its end walls, a rod-and-piston combination extending through the chamber with the rod ends protruding through the openings, a gas inlet port into the chamber above or below the piston, and gas pressure resisting means to resist movement of said piston in response to gas pressure. The diebonding head rod has an axial bore therethrough. Its upper end is configured for connection to a vacuum source and its placement end is configured for mounting of a vacuum tool. Thus, force exerted by the rod placement end on a device being diebonded is adjustable by adjusting the gas pressure relative to the resisting means force. The gas inlet may be above or below the piston. The resisting means may be a helical spring in the same or the opposite end of the chamber as the gas inlet. Alternatively, the resisting means may be pressure from gas entering the opposite end of the chamber from the first gas inlet port. A gas inlet into the lower chamber end wall opening may be used to provide an air bearing to prevent binding of the rod within the opening. A diebonding apparatus and a method for adjusting the force exerted by a device placement head on a device being placed on a substrate are also disclosed.

Gas pressure adjustable diebonding apparatus and method

A solder geometry for epi-down diebonding an optoelectronic component to a heat sink platform includes a solder deposition pattern having exposure windows to create gaps or diebond bridges in the solder pattern. The active regions of the components are disposably registered within the gaps of the solder pattern.

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Taunton, MA, United States of America

Richard H Sargent