Richard H Reese

Title: Richard H. Reese: Innovator in Adhesive Application Technology

Introduction

Richard H. Reese is a notable inventor based in Madison, WI (US). He has made significant contributions to the field of adhesive application technology. His innovative approach has led to the development of a unique apparatus designed to enhance the efficiency of applying adhesive to package components.

Latest Patents

Richard H. Reese holds a patent for an adhesive applicator. This apparatus is specifically designed for applying adhesive to the seal area of an article, particularly a package component. The invention allows for simultaneous application to multiple package components. The apparatus can consist of a single unit or a gang of units, each incorporating a receptacle for holding a body of adhesive. This adhesive may be heated and connected to a source of supply. The adhesive pick-up and applicator element features a lip that picks up adhesive when raised out of the adhesive body. The design includes an actuator that reciprocates the adhesive pick-up element between a lowered position and a raised position, ensuring precise application of adhesive.

Career Highlights

Richard H. Reese is associated with Oscar Mayer Foods Corporation, where he has applied his expertise in adhesive technology. His work has contributed to advancements in packaging processes, enhancing the efficiency and effectiveness of adhesive application in the food industry.

Collaborations

One of his notable coworkers is John A. Jonovic. Together, they have worked on projects that leverage their combined expertise in adhesive technologies.

Conclusion

Richard H. Reese's innovative contributions to adhesive application technology have made a significant impact in the packaging industry. His patent for an adhesive applicator showcases his commitment to improving manufacturing processes.