This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1992.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1992
Title: The Innovations of Richard H. McMaster
Introduction
Richard H. McMaster, an inventive mind based in Wappingers Falls, NY, has made notable contributions to the field of electronics. With a focus on semiconductor packaging, he holds a patent that reflects his ingenuity in this critical area.
Latest Patents
McMaster is credited with a significant patent: a multi-layer package incorporating a recessed cavity for a semiconductor. This innovation involves an electronic component package that features a multilayer ceramic or glass-ceramic substrate. It is formed of stacked, generally parallel signal and insulating layers, each carrying electrically conductive patterns. The design includes a cavity on the substrate surface, specifically sized to accommodate an electronic component with a planar surface that aligns with the substrate surface. Additionally, a series of electrical conductors connect the electronic component to the selected signal layers, enhanced by thin film wiring for optimal connectivity.
Career Highlights
Richard H. McMaster is associated with the well-known technology firm, International Business Machines Corporation (IBM). His work there allows him to blend research and practical application to advance electronic component technology. With a unique invention under his belt, he showcases the intersection of electronic innovation and engineering.
Collaborations
In his endeavors, McMaster has collaborated with esteemed colleagues, including Bai-Cwo Feng and George C. Feng. These partnerships emphasize the importance of teamwork in the innovation process, leading to developments that enhance technological capabilities.
Conclusion
Richard H. McMaster exemplifies the inventor's spirit through his work in semiconductor packaging. His patented innovation not only contributes to the field of electronics but also stands as a testament to collaborative effort in technology advancements. Through his role at IBM and his effective partnerships, McMaster continues to impact the world of electronics significantly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile