Location History:
- Pelham, NH (US) (1991 - 1999)
- Hollis, NH (US) (1997 - 2002)
Company Filing History:
4 out of 6 
3 out of 3 
3 out of 833,002 Years Active: 1991-2002
Title: The Innovative Contributions of Richard H Estes
Introduction
Richard H Estes is a notable inventor based in Hollis, NH (US), recognized for his significant contributions to the field of technology. With a total of 10 patents to his name, Estes has made remarkable advancements, particularly in the area of flip chip mounting techniques. His work has greatly influenced the reliability and efficiency of electronic component bonding processes.
Latest Patents
One of Estes' latest patents focuses on a flip chip mounting technique that enhances the reliability of bonding operations. This invention outlines processes for bonding a flip chip to a substrate, utilizing electrically conductive polymer bumps formed on the bond pads of both the flip chip and the substrate. The method involves applying an insulating adhesive paste over the substrate polymer bumps, aligning the bond pads, and pushing the hardened flip chip polymer bumps through the adhesive. This innovative approach ensures strong bonding and improved reliability in electronic assemblies. Another aspect of his flip chip bonding method involves using a bonding tool to form polymer bumps on an integrated circuit chip, which are then bonded to a circuit board through a carefully controlled process, eliminating the need for piercing through-holes in the adhesive film.
Career Highlights
Throughout his career, Richard H Estes has worked with various companies, including Epoxy Technology, Inc. His experience in the industry has allowed him to develop and refine his innovative techniques, contributing to advancements in electronic manufacturing.
Collaborations
Estes has collaborated with notable professionals in the field, including Frank W Kulesza and Koji Ito. These partnerships have fostered a collaborative environment that has led to further innovations and improvements in technology.
Conclusion
Richard H Estes is a distinguished inventor whose work in flip chip mounting techniques has significantly impacted the electronics industry. His innovative approaches and collaborations have paved the way for advancements that enhance the reliability of electronic components.