Richard Gruenwald

Title: Richard Gruenwald: Innovator in Semiconductor Packaging

Introduction

Richard Gruenwald, based in Potsdam, Germany, is a notable inventor recognized for his contributions to the field of semiconductor packaging technology. With a total of four patents to his name, his work primarily focuses on methods of enhancing electronic die packaging, which has significant implications for the electronics industry.

Latest Patents

Richard's latest inventions include two key patents that demonstrate his expertise in forming packaged semiconductor dies. The first patent, titled "Method for forming packaged semiconductor die with micro-cavity," outlines a comprehensive approach for creating packaged electronic dies. This method involves forming a series of bonding pads on a device wafer, depositing a photoresist layer, and executing precise patterning to create a frame that surrounds the device. The process culminates with cutting the wafer to produce the electronic die and securing it onto a substrate through the application of conductive balls that are heated and compressed.

The second patent, "Packaged semiconductor die with micro-cavity," describes a packaged electronic die that features a micro-cavity. This encapsulated device includes a photoresist frame surrounding the die, ensuring a secure enclosure on a substrate. Encapsulant material is meticulously applied to provide protection, establishing a seal that enhances reliability in various applications.

Career Highlights

Throughout his career, Richard Gruenwald has worked with prominent companies in the technology sector. Notably, he has been associated with Vectron International GmbH and Microchip Technology Inc., where he contributed his expertise in semiconductor technologies and innovation.

Collaborations

Richard has collaborated with talented professionals such as Matthias Klein and Andreas Zakrzewski. His partnerships in the tech industry have fostered an environment of creativity and innovation, facilitating the development of new solutions in semiconductor packaging.

Conclusion

Richard Gruenwald continues to influence the field of semiconductor technology with his innovative patents and collaborative efforts. His work not only enhances the efficiency and reliability of electronic devices but also sets a foundation for future advancements in the industry. As technology continues to evolve, Richard's contributions will undoubtedly play a vital role in shaping the landscape of electronic packaging.