Microchip Technology Inc.

Vectron International Gmbh

Richard Gruenwald

Matthias Klein

Andreas Zakrzewski

Bert Wall

A method for forming a packaged electronic die includes forming a plurality of bonding pads on a device wafer. A photoresist layer is deposited over the device wafer and is patterned so as to form a photoresist frame that completely surrounds a device formed on the device wafer. Conductive balls are deposited over the bonding pads. The wafer is cut to form the electronic die and the electronic die is placed over the substrate. The conductive balls are heated and compressed, moving the electronic die closer to the substrate such that the photoresist frame is in direct contact with the substrate or with a landing pad formed on the substrate. Encapsulant material is deposited such that the encapsulant material covers the electronic die and the substrate. The encapsulant material is cured so as to encapsulate the electronic die. The substrate is cut to separate the packaged electronic die.

Method for forming packaged semiconductor die with micro-cavity

A packaged electronic die having a micro-cavity and a method for forming a packaged electronic die. The packaged electronic die includes a photoresist frame secured to the electronic die and extending completely around the device. The photoresist frame is further secured to a first major surface of a substrate so as to form an enclosure around the device. Encapsulant material extends over the electronic die and around the sides of the electronic die. The encapsulant material is in contact with the first major surface of the substrate around the entire periphery of the electronic die so as to form a seal around the electronic die.

Packaged semiconductor die with micro-cavity

The invention relates to a metallization for a housing, for example for surface wave components, for use in strong magnetic fields as well as a nonmagnetic hermetically sealed cavity housing.

Metallization for a cavity housing and a nonmagnetic sealed cavity housing

The invention relates to a measurement system for the wireless and position-independent measurement of the temperature of the load of an oven with high accuracy using passive temperature probes. The measurement system for the wireless measurement of the temperature of food or workpieces in ovens has an interrogation unit located outside the oven chamber, one or more interrogation antennas located in the oven chamber and at least one passively operated temperature probe with a probe antenna and at least one temperature sensor designed as a resonator, said temperature probe being freely movable within the oven, characterized in that the temperature sensor has at least two resonances with different temperature coefficients of frequency, wherein the electrical equivalent circuit diagrams of the resonance elements differ only slightly from each other.

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Potsdam, Germany

Richard Gruenwald