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For the Inventor, By the Inventor

Hightstown, NJ, United States of America

Richard Gary McDaniel

This inventor holds 26 USPTO granted patents and 8 published patent applications and 9 EPO patents, primarily in Autonomous Robotics. Top assignees: Siemens Aktiengesellschaft, Siemens Product Lifecycle Management Software Inc., Siemens Corporation. Active years: 2009-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard Gary McDaniel. Retrieved from https://idiyas.com/inventor/richard-gary-mcdaniel

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 65.4

 

Average Co-Inventor Count = 1.2

ph-index = 3

Forward Citations = 69(Granted Patents)


Location History:

  • Oakland, CA (US) (2009 - 2011)
  • Peoa, UT (US) (2017)
  • Hightstown, NJ (US) (2011 - 2024)

Company Filing History:

goldMedal17 out of 30,874 
 
Siemens Aktiengesellschaft
 patents
silverMedal4 out of 206 
 
Siemens Product Lifecycle Management Software Inc.
 patents
bronzeMedal3 out of 425 
 
Siemens Corporation
 patents
4. 1 out of 13 
 
Siemens Technology-to-Business Center, LLC
 patents
5. 1 out of 834,513 
Other
 patents

Years Active: 2009-2026

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Areas of Expertise:
Autonomous Systems
3D Reconstruction
Simulation
Task-Oriented Automation
Industrial Applications
Physics Simulation
Behavior Embedding
Graphical Editing
Particle Systems
Code Generation
Multi-Body Physics
Parameter Definition
26 patents (USPTO):Explore Patents
1. 12535821 - Dynamically refining markers in an autonomous world model (2026-01-27),
2. 12523988 - Sharing world model objects between multiple autonomous systems (2026-01-13),
3. 12427674 - Task-oriented 3D reconstruction for autonomous robotic operations (2025-09-30),
4. 12011835 - Engineering autonomous systems with reusable skills (2024-06-18),
5. 11951631 - Object marking to support tasks by autonomous machines (2024-04-09),
6. 11478930 - Simulation assisted planning of motions to lift heavy objects (2022-10-25),
7. 11054812 - Skill interface for industrial applications (2021-07-06),
8. 10747915 - Programming automation sensor applications using simulation (2020-08-18),
9. 10620917 - Programming automation in a 3D graphical editor with tightly coupled logic and physical simulation (2020-04-14),
10. 9959369 - Rigid body proxy for modeling in three-dimensional simulation (2018-05-01),
11. 9797193 - Wildlife access fence and gate devices, systems, and methods (2017-10-24),
12. 9594856 - System and method to embed behavior in a CAD-based physical simulation (2017-03-14),
13. 9424378 - Simulation using coupling constraints (2016-08-23),
14. 9122821 - Method and system for simulation of automated processes (2015-09-01),
15. 9030462 - Sketching three-dimensional(3D) physical simulations (2015-05-12),

Title: The Inventor Profile of Richard Gary McDaniel

Introduction: Richard Gary McDaniel is a distinguished inventor based in Hightstown, New Jersey. With a passion for innovation and problem-solving, he has made significant contributions to various fields through his inventive spirit.

Latest Patents: Richard Gary McDaniel holds several patents in the areas of technology and engineering, showcasing his expertise in creating novel solutions to complex challenges.

Career Highlights: Throughout his career, Richard Gary McDaniel has demonstrated a keen ability to translate ideas into tangible inventions. His innovative approach has led to the development of groundbreaking technologies that have had a lasting impact on the industry.

Collaborations: Richard Gary McDaniel has collaborated with leading researchers, engineers, and scientists to bring his inventions to life. His collaborative efforts have resulted in the successful implementation of cutting-edge technologies in real-world applications.

Conclusion: Richard Gary McDaniel's dedication to innovation and his remarkable track record of success make him a standout figure in the world of inventors. His pioneering work continues to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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