LaGrangeville, NY, United States of America

Richard F Shortt

This inventor holds 3 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1995-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard F Shortt. Retrieved from https://idiyas.com/inventor/richard-f-shortt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 3

Forward Citations = 18(Granted Patents)


Location History:

  • LaGrangeville, NY (US) (1995 - 1996)
  • Poughquag, NY (US) (2002)

Company Filing History:


Years Active: 1995-2002

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3 patents (USPTO):Explore Patents

Title: Richard F. Shortt: Innovator in Semiconductor Technology

Introduction

Richard F. Shortt is a notable inventor based in LaGrangeville, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods and apparatuses that enhance the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

One of Richard's latest patents is titled "Apparatus and method for removing a bonded lid from a substrate." This invention describes an apparatus and method for removing a bonded lid from a substrate of variable size. It includes nesting jaws to support and secure the substrate, and gripping jaws to grip the lid. In operation, the gripping jaws pivot with respect to the nesting jaws, creating a peeling action that separates the lid from the substrate with minimal force and without damaging the substrate or attached semiconductor devices.

Another significant patent is "Structure for repairing semiconductor substrates." This invention relates to a new structure and method for repairing semiconductor substrates, particularly Printed Circuit Boards or other electronic substrates. It provides a method for restoring electrical lines on defective boards by creating trenches or grooves between exposed portions of electrical lines. This allows for the joining of electrical lines to restore electrical continuity, while also providing means for impedance matching of the repaired net.

Career Highlights

Richard F. Shortt is currently associated with International Business Machines Corporation (IBM), where he continues to innovate in the field of semiconductor technology. His work has had a profound impact on the industry, contributing to advancements in electronic substrates and circuit board repair.

Collaborations

Richard has collaborated with notable colleagues such as James M. Levite and Michael Berger. Their combined expertise has fostered a collaborative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Richard F. Shortt is a distinguished inventor whose contributions to semiconductor technology have paved the way for advancements in the field. His innovative patents and collaborative efforts continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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