Shoreview, MN, United States of America

Richard E Offerdahl

This inventor holds 1 USPTO granted patent. Top assignee: Control Data Corporation. Active years: 1977.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard E Offerdahl. Retrieved from https://idiyas.com/inventor/richard-e-offerdahl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 57(Granted Patents)


Company Filing History:


Years Active: 1977

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1 patent (USPTO):Explore Patents

Title: Richard E Offerdahl: Innovator in Circuit Packaging and Cooling

Introduction

Richard E Offerdahl is a notable inventor based in Shoreview, MN (US). He has made significant contributions to the field of circuit packaging and cooling, showcasing his innovative spirit through his patented inventions.

Latest Patents

One of his key patents is focused on circuit packaging and cooling. This invention involves a circuit board equipped with multiple groups of connectors, each capable of receiving a chip carrier. A fluid conduit carrying coolant runs through each group, ensuring efficient thermal management. When a chip carrier is assembled, the circuit chip, which features a heat dissipating bar, is positioned in close contact with the conduit. This design allows for effective electrical and thermal connections, enhancing the performance of electronic devices.

Career Highlights

Richard E Offerdahl has worked at Control Data Corporation, where he has applied his expertise in circuit design and thermal management. His work has contributed to advancements in the electronics industry, particularly in improving the reliability and efficiency of circuit boards.

Collaborations

Throughout his career, Richard has collaborated with notable colleagues, including Douglas M Carlson and Gerald L Ahmann. These partnerships have fostered innovation and have led to the development of cutting-edge technologies in circuit design.

Conclusion

Richard E Offerdahl's contributions to circuit packaging and cooling exemplify his innovative mindset and dedication to advancing technology. His patent reflects a significant step forward in the field, demonstrating the importance of effective thermal management in electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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