Flower Mound, TX, United States of America

Richard E Johnson

This inventor holds 3 USPTO granted patents. Top assignee: Texas Instruments Corporation. Active years: 1991-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard E Johnson. Retrieved from https://idiyas.com/inventor/richard-e-johnson-68yx877z

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.3

ph-index = 3

Forward Citations = 242(Granted Patents)


Location History:

  • Carrollton, TX (US) (1991)
  • Flower Mound, TX (US) (2002)

Company Filing History:


Years Active: 1991-2002

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3 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Richard E. Johnson

Introduction

Richard E. Johnson is a notable inventor based in Flower Mound, Texas, who has made significant strides in the field of semiconductor technology. With three patents to his name, he has demonstrated an exceptional capacity for innovation, particularly in the development of integrated circuit devices that enhance performance and functionality.

Latest Patents

Among Richard's latest patents is the "Integrated Circuit Device with Depressions for Receiving Solder Balls and Method of Fabrication." This invention pertains to semiconductor devices, specifically Ball Grid Arrays or Chip Scale Packages. The patent describes a structure comprising an integrated circuit chip that includes at least one input/output terminal. Surrounding this chip is a body of encapsulation material, forming a generally flat surface that contains at least one dimple designed to accept solder balls or solder paste, ensuring an electrically conductive solderable connection.

Another significant invention by Richard is the "Thermally Enhanced Semiconductor Ball Grid Array Device and Method of Fabrication." This patent outlines a semiconductor device that features a thermally conductive foil with a chip mount portion having two surfaces. The integrated circuit chip is affixed to one surface, and a body of encapsulation material is molded around it. The exposed surface is configured to facilitate thermal contact, allowing for efficient heat dissipation. This innovation may include direct thermal attachment means or configurations that utilize solder balls to connect the chip to a heat sink.

Career Highlights

Richard has been a valuable member of Texas Instruments Corporation, a leader in semiconductor technology. His role has allowed him to contribute to the advancement of integrated circuit devices, impacting various applications in electronics and communication technologies.

Collaborations

Throughout his journey, Richard has collaborated with talented professionals such as Dennis D. Davis and David R. Kee. This teamwork has been instrumental in fostering innovation and enhancing the quality of their projects at Texas Instruments.

Conclusion

Richard E. Johnson's contributions to semiconductor technology, through his inventive patents and collaborative efforts, position him as a key figure in the industry. His commitment to innovation continues to influence the development of advanced electronic components, underscoring the importance of creativity and collaboration in scientific and technological progress.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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