Pampanga, Philippines

Richard Diestro Sumalinog

This inventor holds 1 USPTO granted patent. Top assignee: Texas Instruments Corporation. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard Diestro Sumalinog. Retrieved from https://idiyas.com/inventor/richard-diestro-sumalinog

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Richard Diestro Sumalinog: Innovator in Semiconductor Packaging

Introduction

Richard Diestro Sumalinog is a notable inventor based in Pampanga, Philippines. He has made significant contributions to the field of semiconductor packaging, showcasing his innovative spirit through his patented inventions. His work is particularly recognized for its impact on manufacturing processes in the electronics industry.

Latest Patents

Richard holds a patent for a "Siderail with mold compound relief." This invention describes a method of manufacturing a semiconductor package that involves attaching semiconductor dies to an array of leadframes. The process includes positioning a clip array in alignment with the leadframes within a mold cavity. The clip array features clips that electrically connect to some of the semiconductor dies, along with a siderail that forms a set of reliefs extending from its outer edge to its inner edge. The method also entails injecting a mold compound into the mold cavity through a flow path that includes the reliefs of the siderail, ultimately forming a mold block that partially covers the semiconductor dies. Richard's innovative approach enhances the efficiency and effectiveness of semiconductor packaging.

Career Highlights

Richard is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His role at Texas Instruments allows him to apply his expertise in semiconductor packaging and contribute to the development of advanced technologies. His work is instrumental in driving innovation within the company and the industry at large.

Collaborations

Richard has collaborated with talented coworkers, including Dolores Babaran Milo and Ruby Ann Merto Camenforte. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Richard Diestro Sumalinog is a distinguished inventor whose contributions to semiconductor packaging have made a significant impact on the industry. His innovative patent and work at Texas Instruments Corporation exemplify his commitment to advancing technology. His collaborations with fellow professionals further enhance his contributions to the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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