Richard C Sam

Title: Richard C. Sam: Innovator in Microelectronic Packaging

Introduction

Richard C. Sam is a notable inventor based in Cupertino, CA (US). He has made significant contributions to the field of microelectronics, particularly in the area of packaging and interconnection technologies. His innovative approach has led to the development of advanced methods that enhance the efficiency and reliability of electronic devices.

Latest Patents

Richard C. Sam holds a patent for a "Laser-driven microwelding apparatus and process." This invention focuses on a microelectronic packaging and interconnection apparatus and method that utilizes pulsed laser irradiation to form dual ball bonds, metal bumps, or TAB bonds. Unlike conventional methods that rely on heating, compression, or acoustic techniques, his approach offers a more precise and effective solution. The invention employs a miniature loop forming tool to create a metallic wire loop, facilitating the welding of one end to an IC bond pad and the other to an IC package bonding finger, thereby establishing ball bonds at both ends of the interconnection.

Career Highlights

Richard C. Sam is currently associated with Equilasers, Inc., where he continues to push the boundaries of microelectronic technology. His work has been instrumental in advancing the capabilities of electronic packaging, making it more efficient and reliable for various applications.

Collaborations

Richard has collaborated with Chang-Ming Lin, a fellow innovator in the field. Their partnership has contributed to the development of cutting-edge technologies that enhance microelectronic packaging solutions.

Conclusion

Richard C. Sam's contributions to the field of microelectronics through his innovative patent and work at Equilasers, Inc. highlight his role as a key figure in advancing electronic packaging technologies. His dedication to innovation continues to shape the future of the industry.