The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 1999
Filed:
Jan. 22, 1997
Applicant:
Inventors:
Chang-Ming Lin, San Jose, CA (US);
Richard C Sam, Cupertino, CA (US);
Assignee:
Equilasers, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
21912164 ; 21912163 ;
Abstract
A microelectronic packaging and interconnection apparatus and method in which dual ball bonds, metal bumps, or TAB bonds are formed by pulsed laser irradiation, but not conventional heating, compression or acoustic (e.g., ultrasonic) methods. A miniature loop forming tool is used to form a metallic wire loop, one end of which is welded to an IC bond pad while the other end of which is welded to an IC package bonding finger, thus forming ball bonds at both ends of the interconnection.