Richard C Jaeger

Title: Richard C. Jaeger: Innovator in Integrated Circuit Packaging and Cooling

Introduction

Richard C. Jaeger is a notable inventor based in Auburn, Alabama. He has made significant contributions to the field of electronic equipment through his innovative patent related to integrated circuit packaging and cooling. His work has implications for enhancing the performance and reliability of electronic devices.

Latest Patents

Jaeger's most recent patent focuses on an advanced packaging and cooling structure for integrated circuit chips. This invention features a design where chips are resiliently mounted on wafers located centrally within chambers of a housing. A liquid coolant is strategically forced through orifices to spray the coolant on the wafers behind the chips and directly on the chips themselves. This dual approach provides both high-velocity convective cooling and phase change boiling heat transfer. Additionally, a temperature sensor and control mechanism are integrated to monitor and regulate the temperature within the electronic equipment. This patent is a testament to Jaeger's innovative thinking and technical expertise, and he holds 1 patent in this area.

Career Highlights

Richard C. Jaeger is affiliated with Auburn University, where he contributes to research and development in electronic engineering. His role at the university allows him to engage with cutting-edge technology and collaborate with fellow researchers and students. His work has not only advanced academic knowledge but has also had practical applications in the industry.

Collaborations

Jaeger has worked alongside esteemed colleagues such as John S. Goodling and Norman V. Williamson. These collaborations have fostered a rich environment for innovation and have led to significant advancements in their respective fields.

Conclusion

Richard C. Jaeger exemplifies the spirit of innovation in the realm of electronic engineering. His contributions, particularly in integrated circuit packaging and cooling, highlight the importance of effective thermal management in electronic devices. His work continues to influence the industry and inspire future innovations.