Canton, MI, United States of America

Richard C Floyd

This inventor holds 1 USPTO granted patent. Top assignee: Federal-Mogul Corporation. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard C Floyd. Retrieved from https://idiyas.com/inventor/richard-c-floyd

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Richard C Floyd - Innovator in Well Sealing Technology

Introduction

Richard C Floyd is an accomplished inventor based in Canton, MI (US). He has made significant contributions to the field of well sealing technology, particularly with his innovative designs and methods.

Latest Patents

Richard holds a patent for a "Modular fracture plug and method of construction thereof." This invention provides a solution for temporarily sealing off a well. The modular fracture plug consists of an inner substrate material and an outer shell, which is made up of several individual sections that are bonded together. One section serves as a closed base, another as a closed cover, and there are intermediate sections that contain through openings, forming part of the cavity.

Career Highlights

Richard is currently employed at Federal-Mogul Corporation, where he continues to develop and refine his inventions. His work has been instrumental in advancing technologies related to well sealing.

Collaborations

Some of Richard's notable coworkers include Michael J Myers and Tom Swasey, who have collaborated with him on various projects.

Conclusion

Richard C Floyd's innovative contributions to well sealing technology demonstrate his expertise and commitment to advancing the field. His patent for the modular fracture plug is a testament to his ingenuity and dedication to solving industry challenges.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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